DOI: 10.5176/2251-189X_SEES16.37
Authors: HongSeok Jo, Seongpil An, Kyo Yong Song and Hyun Goo Park
Abstract: Increasing heat removal rate is essential prerequisite for the development of next-generation microelectronic devices. Herein, we demonstrate an efficient fabricating process that shows superior cooling performance which is attributed to the enhanced nano-scale surface area. The cooling enhancement is achieved by the copper oxide-plated polymer nanofiber layers with high surface-to-volume ratio through simple electrospinning and electroplating techniques. The electroplating time and voltage were controlled to optimize the fiber layers for maximal heat removal rate. These layers were characterized by scanning electron microscope (SEM), X-ray diffraction (XRD), and atomic force microscope (AFM). The cooling performance by the layer was demonstrated by comparing temperature reduction at the heater surface.
Keywords: Natural convective heat transfer, Electrospinning, Electroplating, Copper oxide-plated nanofiber
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